1n4001gp thru 1n4007gp vishay semiconductors formerly general semiconductor glass passivated junction rectifier reverse voltage 50 to 1000v forward current 1.0a patented* maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol 1n 1n 1n 1n 1n 1n 1n unit 4001gp 4002gp 4003gp 4004gp 4005gp 4006gp 4007gp maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v * maximum rms voltage v rms 35 70 140 280 420 560 700 v * maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v * maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 75 c i f(av) 1.0 a * peak forward surge current 8.3ms single half sine-wave i fsm 30 a superimposed on rated load (jedec method) * maximum full load reverse current, full cycle average 0.375" (9.5mm) lead length t a = 75 c i r(av) 30 a typical thermal resistance (note 1) r ja 55 c/w r jl 25 * operating junction and storage temperature range t j , t stg 65 to +175 c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 1.0a v f 1.1 v * maximum dc reverse current t a = 25 c 5.0 at rated dc blocking voltage t a = 125 c i r 50 a typical reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 2.0 s typical junction capacitance at 4.0v, 1mhz c j 8.0 pf notes: (1) thermal resistance from junction to ambient at 0.375 (9.5mm) lead length, p.c.b. mounted *jedec registered values do-204al (do-41) features plastic package has underwriters laboratories flammability classification 94v-0 high temperature metallurgically bonded construction cavity-free glass passivated junction capable of meeting environmental standards of mil-s-19500 1.0 ampere operation at t a = 75 c with no thermal runaway typical i r less than 0.1 a high temperature soldering guaranteed: 350 c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-204al, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.012 oz., 0.3 g dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602, and brazed-lead assembly by patent no. 3,930,306 document number 88504 www.vishay.com 08-jul-03 1 0.107 (2.7) 0.080 (2.0) 0.034 (0.86) 0.028 (0.71) dia. 1.0 (25.4) min. 1.0 (25.4) min. 0.205 (5.2) 0.160 (4.1) dia. note: lead diameter is for suffix "e" part numbers 0.026 (0.66) 0.023 (0.58)
1n4001gp thru 1n4007gp vishay semiconductors formerly general semiconductor ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 0 fig. 1 ?forward current derating curve average forward rectified current (a) ambient temperature ( c) 0 fig. 4 ?typical reverse characteristics 5.0 fig. 2 ?maximum non-repetitive peak forward surge current fig. 5 ?typical junction capacitance fig. 3 ?typical instantaneous forward characteristics fig. 6 ?typical transient thermal impedance 25 50 75 100 125 150 175 0.2 0.4 0.6 0.8 1.0 60h z resistive or inductive load 0.375" (9.5mm) lead length 1 10 100 number of cycles at 60h z 10 15 20 25 30 peak forward surge current (a) t j = t jmax 8.3ms single half sine-wave (jedec method) 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward voltage (v) 0.01 0.1 1 10 20 instantaneous forward current (a) 0.01 0.1 1 10 instantaneous reverse current ( a) 60 80 100 20 40 percent of rated peak reverse voltage (%) t j = 25 c t j = 100 c 0.1 1 10 100 reverse voltage (v) 1 10 20 junction capacitance (pf) t j = 25 c f = 1.0mh z vsig = 50mvp-p 0.01 0.1 1 10 100 t -- pulse duration (sec) 0.1 10 100 1 transient thermal impedance ( c/w) t j = 25 c pulse width = 300 s 1% duty cycle www.vishay.com document number 88504 2 08-jul-03
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